Hitachi ACF, usefulness of conductive film

detailed description:
After opening ACF, thaw it for 30-60 minutes before use, and then open it when ACF has thawed to room temperature
After opening ACF, if it is not used up, please seal it and put it in the refrigerator. #lcd display #TFT lcd display 
After we received the goods, they were placed in the refrigerator and refrigerated before use.

If the ACF adhesive hardens completely, loses its stickiness, cannot be removed, or has difficulty separating the colloid from the protective layer, it is considered to have deteriorated or failed. Please stop using it and replace it with a new ACF adhesive

If ACF is used to package products with high ITO density and small spacing between ITO, and packaging failure occurs after multiple uses, please replace it with ACF adhesive with high conductive particle density, such as AC7246

After long-term practice, it has been proven that ACF can be applied to various sizes and models of common LCD screens, and only a very small number of high-resolution ITO screens with extremely small spacing cannot fully adapt.

ACF adhesive is used for bonding TAB or COG of LCD panels. The required technical content is relatively high, and the TAB or COG bonding machines used also require high performance and accuracy. You also need to understand the characteristics of ACF in order to use it proficiently. Due to inadequate technical skills or other issues during the repair process, such as inadequate cleaning or damage to the TAB; The temperature and pressure of the hot press machine have not been properly adjusted, and the balance between the blade and the panel has not been properly adjusted; Or operating in a relatively large dusty space (ACF operates in a dust-free space) can cause bonding failure.

Introduction to ACF Process Points
The relationship between ACF curing strength, depth, and temperature time.
The curing strength of ACF determines the reaction size of its process tension value, curing depth, and strength, which are directly proportional to the accumulated temperature value.
Accumulated temperature value: time x temperature.
The relationship between ACF tensile strength and process pressure.
Because the ACF tensile strength is related to the accumulated temperature value, the effect of pressure on the ACF tensile strength value is shown in the figure. According to its structural diagram, the greater the pressure, the more ACF overflows, and the less ACF between the bumps, the lower the tensile response.
Under normal process conditions, the higher the pressure, the lower the tensile values of FPC, TCP, and FFC.
The relationship between particle rupture status of ACF and time, temperature, and pressure
The rupture of conductive particles is directly related to heat, that is to say, during the process of absorbing heat, particles expand and rupture due to the accumulation of energy, and their expansion range varies with time. Under the combined action of temperature and time, the rupture condition of partecle is proportional to the pressure.

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        May

September 29, 2024